A high-power high brightness LED conductive adhesive, conductive silver adhesive
Conductive adhesiveIt is an indispensable adhesive in LED production packaging, which has a significant impact on
Conductive silver pasteThe requirements are conductivity and thermal conductivity, high shear strength, and strong adhesion.
As a leading brand in the world of high-end electronic adhesives, Advanced Institute Technology has developed conductive adhesives and conductive silver adhesives with good conductivity, strong shear force, good rheological properties, and low moisture absorption. Specially suitable for packaging high-power, high brightness LEDs.
The company's specially developed Research Platinum 600 series
Conductive silver adhesiveIt is particularly suitable for high-power and high brightness LEDs, with a thermal conductivity of 25.8 and a shear strength of 14.7, which is the highest in the industry.
Two LED packaging technology
LED is a type of light emitting device that can directly convert electrical energy into visible light and radiation energy. It has a series of characteristics such as low operating voltage, low power consumption, high luminous efficiency, extremely short luminous response time, pure light color, strong structure, impact resistance, vibration resistance, stable and reliable performance, light weight, small size, and low cost. Its development has made rapid progress, and it can now mass produce high brightness and high-performance products of various colors in the entire visible spectrum range. The production of domestically produced red, green, orange, and yellow LEDs accounts for about 12% of the world's total. During the "15th Five Year Plan" period, the industry goal is to achieve an annual production capacity of 30 billion units, realize the large-scale production of ultra-high brightness AiGslnP LED epitaxial wafers and chips, and produce more than 1 billion units of red, orange, and yellow ultra-high brightness LED chips annually, break through the key technology of GaN materials, and achieve medium batch production of blue, green, and white LEDs. It is predicted that by 2005, the international market demand for LED will be about 200 billion units, with sales reaching 80 billion US dollars.
In the LED industry chain, the upstream involves LED substrate chips and substrate production, the midstream involves LED chip design and manufacturing, and the downstream involves LED packaging and testing. Developing packaging technologies with low thermal resistance, excellent optical properties, and high reliability is a necessary path for the industrialization of new LEDs towards practicality and market. In a sense, it is a link between industry and market. Only packaged products can become end products, be put into practical applications, and provide services to customers, making the industry chain interconnected and seamless.
The particularity of LED packaging
LED packaging technology is mostly developed and evolved based on discrete device packaging technology, but it has significant particularities. In general, the die of discrete devices is sealed inside a package, and the main function of the package is to protect the die and complete electrical interconnection. LED packaging is responsible for outputting electrical signals, protecting the normal operation of the chip, and outputting visible light. It has both electrical and optical parameters, and cannot simply package discrete components for LED design and technical requirements.
en 
