SMT Conductive Silicone Rubber Bullets (Customizable Sizes)

SMT surface mount solder paste process

1. The position of the solder spray printed on the PCB board should be centered with the solder pads, without any significant deviation, and should not affect the adhesion and soldering effect of SMT components. 2. The amount of tin sprayed on the PCB board is moderate, but it cannot fully cover the solder pads, resulting in insufficient tin and missed brushing. 3. The printed solder dots on the PCB board are poorly formed, and the printed solder joints are connected and uneven, resulting in a concave convex shape. The solder joints are displaced by one-third of the solder pads.

2、 SMT SMT SMT Red Adhesive Process

1. The position of the printed red adhesive should be centered without any obvious deviation, and should not affect the adhesion and soldering.

2. The printing red glue has a moderate amount and can adhere well without insufficient glue.

3. The offset of the printing red adhesive dots between the two solder pads may cause difficulty in tinning the components and solder pads.

4. There is too much red glue in the printing, and the width of the glue seeping out from the bottom of the component body is greater than half of the width of the component body.

3、 SMT SMT SMT process

1. SMT component mounting should be neat, centered, without offset or skewness.

2. The component model and specifications at the SMT component mounting position should be correct, and the components should be on the reverse side. Inverted placement of components (it is not allowed to interchange the positions of two relatively symmetrical surfaces of components with differences, such as flipping the surface with silk screen markings and the surface without silk screen markings upside down), the function cannot be achieved.

3. Surface mount components with polarity requirements must be processed according to the correct polarity markings. Device polarity reversal or error (diode, transistor, tantalum capacitor).

4. Multi pin devices or adjacent component pads should have no solder or bridging short circuits.

5. There should be no residual solder beads or slag on the solder pads of multi pin devices or adjacent components.

SMTGasket uses SMT to fix the gasket to the circuit and ground terminal. Its products have high elasticity and circuit contact area, which can be used for EMI countermeasures such as circuit grounding, circuit contact, and buffering effect.

SMTGasket has good elasticity and conductivity, unlike metal springs that are prone to breakage and deformation, and is suitable for any position on PCB. The material and structure of SMT gaskets are patented, SMT gaskets can replace adhesive conductive foam and metal pellets.

Product features and applicability

Excellent grounding characteristics between grounding objects

Super strong electrical conductivity

Stabilization of accessories during surface assembly

Packaged in precision rolls, it can perform precise SMT operations

Superior adhesive strength during SMT assembly

Impedance matching function of PCB or FPCB

Excellent heat transfer performance

EMI shielding

Excellent ESD performance

SMT operation has recovery rate and impact absorption characteristics after completion

Reduce electromagnetic interference noise based on power loss characteristics