Low stress and high thermal conductivity thermal pad

Product Features

Resilience - This product is tough, prevents punctures, and enhances tear resistance, with good mechanical strength.

Universality - This product offers a variety of thicknesses ranging from 1.0mm to 5.0mm, allowing for the molding of complex components.

Thermal conductivity - This product has excellent thermal conductivity and low heat capacity.

Insulation - Excellent insulation to protect circuits from high voltage use.

Environmental friendliness - compliant with ROHS and REACH.

Certification - UL 94V0.

application

Suitable for use in electronic and electrical devices that require thermal conductivity.

Typical applications include:

For example, IT equipment such as computers and servers, industrial control circuits, power systems, automotive electronics, motor controllers, telecommunications equipment, heat pipe assembly, voltage regulators, etc.

Usage

Preprocessing - Die cut this product into the appropriate size according to the intended use.

Glue application - not applicable.

Curing - This product does not require curing.

Specification Table