Heat resistance and thermal stability testing of nickel plated copper foil

Nickel plated copper foilAs an important electronic material, it is widely used in fields such as electronic components, integrated circuits, printed circuit boards, etc. Its heat resistance and thermal stability directly affect the reliability and service life of the product. This article will provide a detailed introduction to the heat resistance and thermal stability testing methods of nickel plated copper foil, and take the nickel plated copper foil produced by Advanced Institute (Shenzhen) Technology Co., Ltd. as an example to explore its performance in actual testing.

Overview of Heat Resistance and Thermal Stability of Nickel Plated Copper Foil

Heat resistance refers to the ability of nickel plated copper foil to maintain its physical, chemical, and mechanical properties in high temperature environments, while thermal stability refers to the degree of stability of its performance during temperature changes. The heat resistance and thermal stability of nickel plated copper foil mainly depend on factors such as the thickness and uniformity of the nickel layer, as well as the bonding strength with the copper substrate.

Heat resistance testing method

Thermogravimetric analysis (TGA)

Thermogravimetric analysis is a commonly used method to evaluate the heat resistance of nickel plated copper foil by measuring the mass change during heating. During the testing process, place the nickel plated copper foil sample on a balance and heat it to the set high temperature at a certain heating rate. Record the curve of its mass change with temperature. By analyzing the curve, the quality loss of nickel plated copper foil at different temperatures can be determined, thereby evaluating its heat resistance performance.Advanced Institute (Shenzhen) Technology Co., LtdThe nickel plated copper foil produced showed excellent heat resistance in TGA testing, with a quality loss of only 0.5% even at a high temperature of 300 ℃.

Differential Scanning Calorimetry (DSC)

Differential scanning calorimetry is used for measurementNickel plated copper foilThe heat absorbed or released during the heating or cooling process is used to evaluate its thermal stability. During the testing process, the nickel plated copper foil sample is heated or cooled together with the reference material, and the relationship curve between temperature and heat change is recorded. By analyzing the endothermic or exothermic peaks in the curve, key parameters such as the phase transition temperature and thermal decomposition temperature of nickel plated copper foil can be determined. The nickel plated copper foil produced by Advanced Institute (Shenzhen) Technology Co., Ltd. has a phase transition temperature of up to 260 ℃ in DSC testing, and there is no obvious thermal decomposition phenomenon in the temperature range of 200 ℃ to 300 ℃, indicating that it has good thermal stability.

Thermal stability testing method

Thermal Shock Test

Thermal shock testing is a method of evaluating the thermal stability of nickel plated copper foil by simulating the sudden temperature changes that may be encountered in practical applications. During the testing process, the nickel plated copper foil sample was repeatedly switched between high and low temperatures, and its performance changes at different temperatures were recorded. For example, the nickel plated copper foil produced by Advanced Institute (Shenzhen) Technology Co., Ltd. showed no significant changes in its conductivity and mechanical strength after 100 cycles of thermal shock testing at -40 ℃ to 150 ℃, demonstrating good thermal stability.

High temperature aging test

The high-temperature aging test is toNickel plated copper foilA method of evaluating the performance of samples over time by placing them in a high-temperature environment for a long time. During the testing process, place the nickel plated copper foil sample in a set high temperature environment, regularly remove it for performance testing, and record its performance changes. For example, in the high-temperature aging test at 125 ℃, the nickel plated copper foil produced by Advanced Institute (Shenzhen) Technology Co., Ltd. showed only a 5% decrease in conductivity after 1000 hours, and there was no obvious oxidation or peeling on the surface, indicating its excellent thermal stability.

Test performance of nickel plated copper foil by Advanced Institute (Shenzhen) Technology Co., Ltd

The nickel plated copper foil produced by Advanced Institute (Shenzhen) Technology Co., Ltd. has shown excellent performance in heat resistance and thermal stability tests. The nickel plating layer is uniform and dense, with strong adhesion to the copper substrate, and can maintain stable physical, chemical, and mechanical properties in high temperature environments. Under various testing methods such as thermogravimetric analysis, differential scanning calorimetry, thermal shock testing, and high-temperature aging testing, excellent heat resistance and thermal stability have been demonstrated, meeting the high-performance requirements of the electronics industry for nickel plated copper foil.

conclusion

Nickel plated copper foilThe heat resistance and thermal stability are key indicators for its application in the field of electronics. The heat resistance and thermal stability of nickel plated copper foil can be comprehensively evaluated through methods such as thermogravimetric analysis, differential scanning calorimetry, thermal shock testing, and high-temperature aging testing. The nickel plated copper foil produced by Advanced Institute (Shenzhen) Technology Co., Ltd. provides reliable material support for the electronics industry with its excellent performance. In the future, with the continuous development of electronic technology, the heat resistance and thermal stability testing of nickel plated copper foil will become more important, and related testing methods and technologies will continue to be improved and innovated.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.