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| Silver palladium paste for electronic components | YB-8801PD series | ||||
| Specification Description: | content | 50-70% | |||
| fineness | <7um | ||||
| Viscosity | 10~50pa.s | ||||
| sheet resistivity | * | ||||
| adhesion | * | ||||
| solderability | * | ||||
| Usage conditions: | base material | * | |||
| 300-500 mesh | |||||
| dry | 70~90℃ | ||||
| sinter | 950~1200℃ | ||||
| Product application areas | |||||
| Stacked component electrode | |||||
  
 
 
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