Thermosetting conductive adhesive

Conductive adhesiveapplication

CBF product structure and characteristics:

Note: Customers choose according to the step of the grounding hole

The main characteristics of CBF are as follows:

1. Excellent shielding properties

2. Can obtain stable electrical connections

3. Excellent adhesion with reinforcing plates such as Ni sus, continuous increase in peel strength after reflow soldering, and decrease in grounding resistance.

4. Can adapt to lead-free reflow soldering and has good filling properties

5. Can meet the environmental requirements of halogen-free and RoHS

6. Lower water absorption rate

7. After the double 85 test, high reliability can be achieved

8. Better chemical resistance
 

Change in PEEL value after reflow soldering of CBF products

Change in resistance value of CBF products after reflow soldering

CBF product filling ability

CBF products have high temperature and high humidity resistance value changes