The use of a modified epoxy conductive adhesive for IC chip packaging with conductive silver adhesive

Conductive silver adhesive for IC chip packaging
Conductive Adhesive
Heat curing/high adhesive strength/high thermal conductivity
IC packaging conductive adhesive:Research on Platinum Conductive Silver AdhesiveIt is a modified epoxy conductive adhesive that requires low-temperature storage (-40 ℃) and can be used for LED light-emitting diodes (replacing 84-1A conductive adhesive). Smooth dispensing, good shape retention (no deformation, collapse, or diffusion of adhesive points), high bonding strength, excellent conductivity, and outstanding thermal conductivity.
Usage: Conductive adhesive for IC chip packaging.

Specialty:
Smooth dispensing without trailing or drawing phenomena;
No glue flows after unloading;
The adhesive point does not collapse, does not spread, and has good shape retention;
Excellent conductivity;
High adhesive strength;
Excellent thermal conductivity.

Pre curing characteristics

Characteristics after curing