High conductivity PI copper plated film: a new era for electronic components

###High conductivity PI copper plated film: a new era for electronic components

In today's rapidly advancing technology, the performance requirements for electronic components are increasing, especially in terms of conductivity, high temperature resistance, and oxidation resistance. Advanced Institute (Shenzhen) Technology Co., Ltd., with its outstanding research and development capabilities, has launched a high conductivity PI copper plated film designed specifically for electronic components. It not only solves the limitations of traditional materials, but also opens up a new chapter in materials science. This article will explore in depth how this innovative material leads the new era of electronic components from multiple dimensions, including material properties, application examples, performance advantages, and market prospects.

####PI Copper Coating: A Revolution in Materials Science**

PI (Polyimide), as a high-performance polymer, has a wide range of applications in electronics, aviation, medical and other fields due to its excellent insulation, high mechanical strength and good processability. However, pure PI materials have natural defects in conductivity, making it difficult to meet the high conductivity requirements of modern electronic components. Advanced Institute (Shenzhen) Technology Co., Ltd. has successfully uniformly covered the surface of PI substrate with a copper layer through a unique copper plating process, retaining the excellent performance of PI and endowing the material with outstanding conductivity.

**Data Speaking: According to laboratory tests, the conductivity of the PI copper plated film can reach over 10 ^ 6 S/m, far exceeding the conductivity of ordinary insulation materials and comparable to pure copper materials. At the same time, it has excellent thermal stability and can work for a long time in a high temperature environment of 250 ℃ without performance degradation. Its antioxidant performance has reached the leading level in the industry, effectively extending the service life of electronic components.

####Application Example: From Small to Large Changes**

1. * * Microelectronic Packaging * *: In the packaging process of integrated circuits, PI copper plated film has become an ideal choice for connecting chips and external circuits due to its high conductivity and good thermal stability. Its thin as a cicada's wing but capable of withstanding high temperatures and pressures makes the packaging process more efficient, significantly increasing packaging density and providing a solid hardware foundation for cutting-edge technologies such as 5G communication and the Internet of Things.

2. * * Flexible Display Screen * *: With the rise of flexible electronic products, PI copper plated film has played an important role in the manufacturing of flexible display screens. It not only serves as a conductive layer to ensure stable signal transmission, but also, due to its excellent flexibility, allows the display screen to bend, fold, and even curl, greatly expanding the form and application scenarios of electronic products.

3. * * New Energy Vehicles * *: In the field of new energy vehicles, PI copper plated film is used for sensors and connectors in battery management systems. Its high temperature resistance and oxidation resistance ensure the stable operation of the battery system in high current and high temperature environments, providing reliable guarantees for the safety and endurance of new energy vehicles.

####Performance advantage: Beyond tradition, leading the future**

-High conductivity: Compared with traditional insulation materials, PI copper plated film significantly improves the signal transmission speed and efficiency of electronic components, reduces energy loss, and provides possibilities for high-speed data transmission and efficient energy utilization.

-High temperature resistance and oxidation resistance: It can maintain stable performance under extreme conditions, extend the service life of electronic products, reduce maintenance costs, and is particularly suitable for extreme environmental applications such as aerospace and deep-sea exploration.

-Lightweight and Flexibility: The lightweight and flexible properties of PI substrates make PI copper plated films the preferred material for lightweight design and flexible electronic products, driving rapid development in fields such as wearable devices and smart homes.

####Market outlook: infinite possibilities, huge potential**

With the rapid development of emerging technologies such as 5G, IoT, and artificial intelligence, the demand for high-performance electronic components will continue to grow. As a representative of the new generation of electronic materials, the unique performance advantages of PI copper plated film make it have broad application prospects in the future market. From smartphones and wearable devices to new energy vehicles and aerospace, PI copper plated film is gradually penetrating into various industries and becoming one of the key factors driving technological progress.

As a leader in PI copper plating film, Advanced Institute (Shenzhen) Technology Co., Ltd. continuously optimizes product performance and expands production capacity through technological innovation and industrial upgrading to meet the growing market demand. At the same time, the company is actively exploring composite applications with other advanced materials, striving to go further on the path of materials science and contribute more to the future development of the electronics industry.

In summary, high conductivity PI copper plated film is not only a revolution in electronic component materials, but also a catalyst for technological progress. It is leading the electronics industry towards a more efficient, intelligent, and sustainable future with its unique performance advantages. In this new era full of infinite possibilities, PI copper plated film is undoubtedly the most dazzling star.