Advanced Institute Technology PET Copper Plating Film | Innovative Application of High Performance Composite Materials

In the fields of new energy, electronic information, and high-end manufacturing, breakthroughs in material performance often become the core driving force for technological iteration. Advanced Institute of Technology Research and DevelopmentPET copper plated filmAs a new type of composite material that combines polymer flexibility and metal conductivity, it is demonstrating irreplaceable value in multiple industrial scenarios due to its unique process advantages and customization capabilities.

Collaborative innovation of material structure and preparation process

The core structure of PET copper plated film consists of a polyethylene terephthalate (PET) substrate and a copper conductive layer. PET film, as a substrate, has excellent mechanical strength, chemical stability, and low moisture absorption. Its thickness can be precisely controlled within the range of 4-100 μ m, meeting the flexibility and support requirements of different scenarios. The copper layer is deposited on the surface of PET through vacuum magnetron sputtering technology or chemical plating process in physical vapor deposition (PVD), forming a conductive layer with uniform thickness and strong adhesion. Vacuum magnetron sputtering technology uses high-energy ion bombardment of copper targets to uniformly deposit copper atoms on the surface of PET in a vacuum environment, forming a dense, low defect conductive thin film with controllable thickness of ± 0.1 μ m; Chemical plating catalyzes the formation of a copper layer on the surface of PET through oxidation-reduction reactions, making it suitable for metalization treatment of substrates with complex morphologies. The complementarity of the two processes enables Advanced Institute Technology to provide customized solutions based on customers' needs for conductivity, cost, and production efficiency.

Accurate control capability of performance parameters

Advanced Institute of TechnologyThe performance advantages of PET copper plated film are reflected in the precise control of multidimensional parameters. In terms of conductivity, the thickness of the copper layer and surface roughness directly affect the square resistance value. By adjusting the sputtering power or chemical plating time, the square resistance can be controlled within the range of 0.01-1 Ω/□, meeting the low resistance requirements of high-frequency circuits, electromagnetic shielding, and other scenarios. In terms of mechanical properties, the interface bonding strength between PET substrate and copper layer can be optimized through pretreatment processes, such as plasma cleaning or chemical coupling agent treatment, to achieve a peel strength of ≥ 1.5N/mm, ensuring that the material does not delaminate in dynamic usage scenarios such as bending and winding. In addition, the surface of the copper layer can be further treated with electroplating or chemical passivation to enhance its corrosion resistance, enabling it to pass the 96 hour rust free standard in salt spray testing and adapt to harsh environmental applications.

Application Practice and Technical Verification of a Research Institute in Lanzhou

A research institute in Lanzhou recently purchased advanced institute technology PET copper plated film for its new energy battery current collector research and development project. The research institute has strict requirements for materials: to achieve tear resistance at an extremely thin thickness of 0.5mm while ensuring conductivity, in order to adapt to the winding process of the next generation of solid-state batteries. Advanced Institute Technology has provided a customized product with a thickness of 4.5 μ m, a square resistance of 0.05 Ω/□, and a tensile strength of ≥ 200MPa by optimizing the PET substrate formula and copper layer deposition process. After laboratory testing, the material showed a resistance change rate of less than 2% after 1000 cycles of bending, fully meeting the verification standards for material reliability set by the research institute. At present, the product has entered the pilot stage, providing key material support for improving the energy density of solid-state batteries.

Customized services and industry solutions

The technological barriers of advanced institute technology are not only reflected in material performance, but also in its ability to quickly respond and customize. The company is equipped with full process equipment from laboratory trials to mass production, which can achieve flexible adjustment of copper layer thickness, PET substrate functionalization (such as anti-static and flame retardant), and patterned deposition. For example, in response to the sensitive demand for high-frequency losses in the 5G communication field, ultra smooth copper layer surface treatment technology has been developed to reduce surface roughness to Ra ≤ 50nm, significantly reducing signal transmission losses; Provide stretchable PET copper plated film for flexible electronic devices, designed with a microgrid copper structure to maintain conductivity continuity even under 30% tensile strain.

At present, Advanced Institute of TechnologyPET copper plated filmA solution library covering new energy, consumer electronics, aerospace and other fields has been formed, and joint research and development mechanisms have been established with multiple scientific research institutions. The cooperation case of a research institute in Lanzhou further verified the adaptability of the material in the high-end manufacturing field. With the continuous growth of downstream industries' demand for lightweight and high-performance materials, the technological iteration and scene expansion of PET copper plated film will continue to deepen, providing core material support for industrial upgrading.