How to use thick film hybrid integrated circuit silver palladium paste to achieve circuit connection of thick film circuits

In the development of modern electronic technology, thick film hybrid integrated circuits (THICs) have become one of the key technologies in electronic device manufacturing due to their high reliability, low manufacturing cost, and wide range of applications. Thick film circuits achieve circuit integration by directly forming circuit components and connection lines on the substrate. Thick film hybrid integrated circuit silver palladium paste, as an important conductive material, plays a crucial role in the circuit connection of thick film circuits. This article will introduce how to utilize the advanced technology of Advanced Institute (Shenzhen) Technology Co., LtdResearch Platinum YB8503 Thick Film Hybrid Integrated Circuit Silver Palladium PasteRealize the circuit connection of thick film circuits.

1、 Characteristics of silver palladium paste for thick film hybrid integrated circuits

Yanbo brand YB8503 thick film hybrid integrated circuit silver palladium paste is a type of paste containing silver and palladiumconductive pasteIt has excellent conductivity and stability. Its main components include silver particles and palladium particles, which provide the main conductive pathways. Silver particles have high conductivity and good conductivity properties, while palladium particles are used to enhance and stabilize conductivity. In addition, the slurry also contains components such as solvents or matrices, dispersants, and auxiliary agents, which together ensure the printability, viscosity, and thermal conductivity of the slurry.

2、 Implementation steps of thick film circuit line connection

1. Substrate preparation

Firstly, choose a suitable ceramic or glass substrate as the circuit carrier. The substrate needs to undergo surface treatment such as cleaning and degreasing to ensure that the slurry can firmly adhere to the substrate.

2. Preparation of silver palladium slurry

Thoroughly stir the YB8503 thick film mixed integrated circuit silver palladium paste of the research platinum brand to ensure that the viscosity, fineness, and other parameters of the paste meet the requirements of printing and sintering processes.

3. Line design

Design circuit diagrams and determine the layout and connection methods of components based on circuit functional requirements. This step requires precise calculation of the length, width, and spacing of the circuit to ensure its stability and reliability.

4. Line printing

Using methods such as screen printingResearch Platinum YB8503 Thick Film Hybrid Integrated Circuit Silver Palladium PastePrint onto the substrate to form the desired circuit pattern. During the printing process, it is necessary to control the thickness and uniformity of the paste to avoid problems such as poor circuit connections or short circuits.

5. Sintering treatment

Perform sintering treatment on the printed substrate under specific temperature conditions. During the sintering process, the silver palladium slurry will form a strong bond with the substrate, while the organic components in the slurry will evaporate, leaving behind a metal conductive path. The sintering conditions need to be optimized based on the characteristics of the slurry and substrate material to ensure good bonding strength and electrical performance.

6. Line detection and testing

After sintering, it is necessary to conduct connectivity and resistance tests on the circuit to ensure the correctness and reliability of the circuit connection. In addition, the performance and stability of the entire circuit can be evaluated through functional testing and reliability testing.

3、 Technical support from Advanced Institute (Shenzhen) Technology Co., Ltd

As a supplier of thick film hybrid integrated circuit silver palladium paste,Advanced Institute (Shenzhen) Technology Co., LtdProvided comprehensive technical support and services. The company not only has advanced research and development and production capabilities, but also can provide customized slurry solutions according to customer needs. In addition, the company also provides detailed technical information and guidance to help customers better use the silver palladium paste of Yanbo brand YB8503 thick film hybrid integrated circuit to achieve circuit connection of thick film circuits.

4、 Conclusion

The use of thick film hybrid integrated circuit silver palladium paste to achieve circuit connection of thick film circuits is an important technical challenge. By selecting appropriate pastes, optimizing printing and sintering processes, and leveraging the technical support of Advanced Institute (Shenzhen) Technology Co., Ltd., we can effectively achieve circuit connections for thick film circuits, providing reliable technical support for the manufacturing of electronic devices. With the continuous development of electronic technology, thick film hybrid integrated circuit silver palladium paste will play an important role in more fields, promoting the continuous progress and innovation of the electronics industry.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.