LCP thin film metallization technology: a core material solution for empowering 5G/6G high-frequency communication

1、 In the era of high-frequency communication, the material revolution is imperative

With the accelerated evolution of 5G towards 5.5G and even 6G, communication frequency bands are constantly extending towards the millimeter wave region. The higher the frequency, the more significant the attenuation of the signal in the transmission medium, which puts unprecedented demands on the basic materials that carry the signal. Traditional polyimide (PI) films experience a sharp increase in dielectric loss at high frequencies, making it difficult to meet the requirements of millimeter wave applications. Liquid crystal polymer (LCP) films are moving towards the forefront of the industry in this technological context.

LCP film has high strength, high heat resistance, extremely low coefficient of linear expansion, excellent flame retardancy and dielectric properties, especially suitable for high-frequency and high-speed related application scenarios. Its dielectric constant can be as low as 2.9, and the loss factor can be as low as 0.001-0.003 (@ 10GHz), maintaining stable dielectric performance in the ultra wideband range of 1GHz to 75GHz. At the same time, the water absorption rate of LCP film is less than 0.1%, and its extremely low moisture absorption effectively avoids the scattering and absorption of high-frequency signals by moisture - which is particularly critical in practical use environments with varying humidity.

2、 From insulation to conductivity: a technological leap in LCP thin film metallization

LCP film itself is an excellent insulating material, and in order for it to function in high-frequency circuits, it must be metalized by forming a conductive metal layer on the surface of LCP. However, the surface energy of LCP is relatively low (about 32mN/m), with strong chemical inertness, making it difficult for the metal layer to firmly adhere directly. Traditional wet processes such as screen printing silver paste have low feasibility on LCP, and the mainstream technology route is dry coating - first depositing a seed layer on the surface of LCP by magnetron sputtering, and then thickening it to the target thickness by pulse electroplating.

During this process, plasma pretreatment is a crucial step. Plasma treatment can increase the roughness and activity of LCP surface, creating favorable conditions for subsequent metal deposition. Advanced Institute (Shenzhen) Technology Co., Ltd. has successfully improved the adhesion of the gold layer on the LCP surface to the 5B level standard through plasma pretreatment and gradient transition layer technology - the highest level of adhesion testing in the industry. From material pretreatment, surface treatment, coating deposition to finished product testing, the company has achieved precise control and process optimization throughout the entire process.

3、 Multi metallic system: functional coatings with each performing its own duties

In the selection of metal materials for LCP metallization, Advanced Institute Technology has established a complete coating system covering multiple metals:

Gold (Au)It is the most important functional coating, prepared by sputtering electroplating process, with good conductivity, strong oxidation resistance, and biocompatibility. The thickness of gold-plated LCP film can be customized within the range of 50 μ m to 100 μ m to meet the differentiated needs of different application scenarios. The gold-plated LCP film retains the original mechanical strength, thermal stability, and electrical properties of LCP, while also endowing the gold layer with good conductivity, corrosion resistance, and beautiful appearance.

Copper (Cu)It is the core conductor material of high-frequency copper-clad laminate (LCP-FCCL). LCP-FCCL is a high-frequency flexible copper clad laminate made by using LCP film as the dielectric substrate and applying low profile electrolytic copper foil or rolled copper foil on one or both sides through high-temperature vacuum lamination process.

Nickel (Ni)Mainly used as a barrier layer to prevent copper diffusion, it is also commonly coated with gold and tin composite coatings (such as Ni/Au, Ni/Sn).Silver (Ag)The conductivity is extremely high and has practical value in specific scenarios.Tin (Sn)Solderable surface treatment for LCP-FPC pads.

Titanium (Ti) and Chromium (Cr)As a transition layer, although not a functional layer, it is the key to enhancing the adhesion of precious metals on LCP.Niobium titanium (NbTi)This represents the forefront exploration direction of advanced research in the field of science and technology - the company has conducted experimental research on LCP thin film niobium titanium plating. According to test data, at the GHz frequency band, the signal attenuation rate of LCP thin film niobium titanium plating is reduced by about 30% compared to traditional materials.

4、 From mobile phone antennas to car radar: diverse applications are fully deployed

High frequency and high-speed communication field， The LCP millimeter wave antenna module uses LCP film/copper-clad laminate as the dielectric carrier to interconnect the millimeter wave array antenna, feeder, and RF on a flexible structure, suitable for 5G/6G millimeter wave terminals and small base stations. By 2025, the global sales of LCP millimeter wave antenna modules will reach 65.1 million units. The LCP thin film gold-plated high-speed data transmission line is designed specifically for high-frequency signal transmission, achieving the ultimate reduction of signal loss.

Vehicle mounted radar field， 77GHz millimeter wave radar has extremely strict material requirements. LCP-FCCL has become one of the core materials for high-frequency PCBs in vehicle radar due to its low dielectric constant and low loss characteristics. With the advancement of ADAS and autonomous driving, this demand is rapidly being released.

Flexible Electronics and Consumer ElectronicsIn the field, the thickness of LCP film can be controlled between 5-100 μ m, combining flexibility and high strength, suitable for flexible circuit design such as FPC hinge wires inside foldable screen phones and wearable devices.

Medical implantable devicesIn terms of aspect, LCP thin film gold plating technology, with its good biocompatibility and high processing accuracy, can be used for precision medical devices such as nerve stimulator packaging, catheters, endoscopes, etc. LCP itself is considered an ideal choice for flexible electrode materials in brain computer interfaces due to its low hygroscopicity, chemical stability, and thermoplastic bonding ability.

electromagnetic shieldingOn the one hand, LCP substrate sputtering anti EMI coating can provide efficient shielding performance for high-frequency FPC in the context of increasingly strict signal integrity requirements for 5G millimeter wave and vehicle radar.

5、 The market is expanding rapidly, and domestic substitution is entering a window period

In terms of market size, the global LCP film and laminate market is estimated to be worth approximately $235.2 million by 2025, and is expected to grow to $460.4 million by 2032, with a compound annual growth rate of 10.07%. The global market size of LCP millimeter wave antenna modules is expected to exceed 1.498 billion US dollars by 2032. The Asia Pacific region is the world's largest LCP film market, with a market share of approximately 72%. China, Japan, and South Korea are in the material FCCL、 The module manufacturing and terminal assembly fields have formed a dense industrial chain.

From a competitive perspective, the top five LCP film manufacturers worldwide hold approximately 93% of the market share. However, as the United States continues to tighten export controls on high-end electronic materials, domestic terminal manufacturers are accelerating the construction of domestic LCP supply chains. In December 2025, domestic enterprises achieved the large-scale application of LCP film products in mobile terminal devices, breaking the long-term monopoly of foreign manufacturers in the high-end LCP film application field and achieving a breakthrough from 0 to 1 in domestic mobile terminal applications. This breakthrough will have a profound impact on various terminal fields under the future 6G/millimeter wave high-frequency communication network.

6、 Advanced Institute of Technology: A deep cultivator of LCP metallization process

Advanced Institute (Shenzhen) Technology Co., Ltd. has become an important participant in the field of LCP thin film metallization with its full process control capabilities from material pretreatment, coating process optimization to finished product testing. The company ensures a strong bond between the metal layer and LCP film through precise chemical deposition, physical sputtering, or electroplating techniques, while maintaining the uniformity and glossiness of the metal layer.

The company's core product line covers:

• LCP film gold platingThe thickness can be customized within the range of 50 μ m to 100 μ m, combining the excellent mechanical properties of LCP with the conductivity and corrosion resistance of the gold layer. For more information, please refer toLCP film gold-plated products
• LCP high-frequency double-sided copper-clad laminate (LCP-FCCL)Made using high-frequency communication technology, widely used in fields such as 5G base station antennas and millimeter wave radar.
• LCP nickel/copper platingMeet the demand for electromagnetic shielding and conductive connections in fields such as consumer electronics and industrial control.
• LCP thin film coated with niobium titaniumRepresenting the company's technological reserves in the field of cutting-edge materials, it is expected to open up new application space in areas such as terahertz antennas and superconducting composite devices.

7、 Driving the Future of High Frequency Communication with Material Innovation

From millimeter wave antennas in 5G smartphones, to 77GHz in car radar, to ribbon cables for foldable screens and electrodes for brain computer interfaces - LCP thin film metalized products are moving from laboratories to large-scale commercial use, becoming a key bridge connecting the physical world and the digital world.

With the comprehensive arrival of the 5.5G commercial era and the explosive growth of AI computing power demand driving the release of high-end application demands such as data centers and AI servers, the market space for LCP thin film metallization products is accelerating. Advanced Institute (Shenzhen) Technology Co., Ltd. will continue to deeply cultivate the field of LCP thin film metallization, drive product upgrades with technological innovation, provide key material support for the independent controllability of the high-frequency communication industry chain, and help China move from a material giant to a material powerhouse.