Gold paste for aluminum nitride: a new technological chapter under 850 degree sintering

**Gold paste for aluminum nitride: a new technological chapter under 850 degree sintering**

In today's rapidly developing high-tech world, materials science, as an important cornerstone of technological progress, is constantly driving technological innovation in various industries. Among numerous new materials, aluminum nitride (AlN) has shown great potential for applications in electronic packaging, high-power electronic devices, LED heat dissipation, and other fields due to its excellent thermal conductivity, high hardness, good insulation, and outstanding mechanical properties. In order to fully leverage the advantages of aluminum nitride materials, a gold paste specially designed for aluminum nitride and capable of efficient sintering at 850 degrees has emerged. It is created by the technology research and development team of the Advanced Institute, representing not only the latest achievements in materials science, but also providing strong support for the upgrading of related industries.

The development of this gold paste for aluminum nitride is based on a deep understanding and precise grasp of the characteristics of aluminum nitride materials. The high melting point and hardness of aluminum nitride make it difficult for traditional sintering processes to form a stable and conductive metal layer on its surface, which greatly limits its application in high-end electronic packaging. In response to this challenge, the R&D team of the Advanced Institute has finally developed a gold paste that can perfectly bond with aluminum nitride at 850 degrees through countless experiments and optimizations. The selection of this temperature point ensures that the metal components in the gold paste can effectively penetrate into the microstructure of aluminum nitride, forming a strong chemical bond, while avoiding thermal damage to the aluminum nitride substrate caused by excessive temperature, thereby ensuring the performance and reliability of the final product.

The core technology of this gold paste lies in its unique formula and refined preparation process. By carefully selecting a scientific ratio of gold powder, organic carrier, and a series of functional additives, the gold paste can exhibit good fluidity and wettability during the sintering process, ensuring that the metal layer can uniformly cover the surface of aluminum nitride, forming a continuous and dense conductive network. Meanwhile, special additives can also promote the interfacial reaction between metal and aluminum nitride during the sintering process, further enhancing the bonding strength between the two. In addition, the preparation process of the gold paste adopts advanced nanotechnology and precision control technology, ensuring the uniform dispersion of gold powder and precise control of particle size, laying a solid foundation for high-quality sintering.

In practical applications, this aluminum nitride gold paste has demonstrated excellent performance. It not only significantly improves the conductivity and thermal conductivity of aluminum nitride based electronic packaging, but also effectively reduces the thermal resistance during the packaging process and enhances the heat dissipation efficiency of the device. This is of great significance for improving the operational stability and extending the service life of high-power electronic devices. At the same time, the good sintering performance of the gold paste and its excellent compatibility with aluminum nitride also make the packaging process simpler and more efficient, reducing production costs and improving production efficiency.

It is worth mentioning that the successful development of this gold paste is not only a major breakthrough in the field of materials science by the Advanced Institute, but also a vivid interpretation of the integrated innovation model of "industry university research application". From basic research to application development, and then to industrial promotion, every link embodies the wisdom and sweat of researchers. In the future, with the widespread application of this gold paste in more fields, it will inject new vitality into the development of strategic emerging industries such as electronic information, aerospace, and new energy vehicles, and promote China's high-tech industry to a higher level.

The successful sintering of gold paste for aluminum nitride at 850 degrees is not only a technological innovation in the field of materials science, but also a powerful proof of the deep integration of technological progress and industrial upgrading. It shows us the power of technological innovation and fills us with anticipation for the future.